Product Center
One-stop enterprise storage and memory solutions: PCIe Gen4/Gen5 NVMe SSDs (U.2/E1.S/E3.S/AIC), QLC high-capacity and low-latency high-endurance SSDs, paired with DDR4/DDR5 server memory and CXL memory expansion — plus 2.5" SATA, M.2 and SATA DOM industrial storage — for data centers, AI computing and industrial control.
AI Computing Servers
4 / 8 / 10-GPU · air & liquid cooling · PCIe 5.0 · cluster delivery
JH AI computing servers span edge inference, enterprise inference, training clusters and high-density nodes: the 8-GPU RTX 6000D platform, the 10-GPU Thor T5000 high-density inference platform, 8-GPU air-cooled and 8-10 GPU liquid-cooled Intel/AMD platforms, plus PC-Farm distributed-node servers — delivered air- or liquid-cooled up to rack-scale clusters, qualified in one compatibility loop with our enterprise SSDs and DDR5 RDIMM.
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| Model | Specification | Features | |
|---|---|---|---|
| 8-GPU AI Server (RTX 6000D Platform) | 8×GPU · 4U/5U rack-mount · 8× GPU · 600W | 8× dual-width GPUs · 600W each · 11× PCIe 5.0 |
 | 10-GPU High-Density Inference Server (Thor T5000) | 10×GPU · High-density rack · 10× T5000 | Up to 10 dual-die T5000 · 10× PCIe 5.0 x16 · 4× CRPS |
 | 8-GPU Air-Cooled AI Server (Intel / AMD) | 8×GPU · 4U/5U rack-mount · 8× GPU · 600W | 8× dual/quad-width blower GPUs · 12× PCIe 5.0 · 12× LFF |
 | 8-10 GPU Liquid-Cooled AI Server | 8-10×GPU · 4U/5U rack-mount · 8-10× GPU · 600W | 8-10 triple-width GPUs · full cold-plate coverage · 12× PCIe 5.0 |
 | PC-Farm Distributed-Node Server 4U4H | PC-Farm · 4U rack-mount · 4× Node | 4 hot-plug PC nodes · 750W per node · 4× CRPS 1100W |
 | PC-Farm Distributed-Node Server 6U6H | PC-Farm · 6U rack-mount · 6× Node | 6 hot-plug PC nodes (1 GPU each) · 750W per node · 4× CRPS 1100W |
AI Inference Workstations
Junhangclaw series · 50 TOPS to 2070 TFLOPS · personal to enterprise
The Junhangclaw personal super-workstation series spans four tiers, from a 50 TOPS domestic-silicon entry model to the flagship JH-W2000 with an NVIDIA Blackwell GPU delivering 2070 TFLOPS (FP4 sparse) — built for local AI inference where private data never leaves the premises.
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| Model | Specification | Features | |
|---|---|---|---|
 | JH-W50 Entry | 50 TOPS · Entry · 50 TOPS | Domestic silicon · 50 TOPS · personal users |
 | JH-W120 Enhanced | 120 TOPS · Enhanced · 120 TOPS | 120 TOPS · small teams |
 | JH-W280 Professional | 280 TOPS · Professional · 280 TOPS INT8 | MetaX domestic silicon · 280 TOPS INT8 · localization-ready |
 | JH-W2000 | 2070 TFLOPS · Flagship compact · 128GB · 1TB | Blackwell GPU · 2070 TFLOPS FP4 sparse · 128GB unified memory |
| JH-W2000N Flagship | 2070 TFLOPS · Flagship expanded · 128GB · 1TB+4bay | Blackwell GPU · 2070 TFLOPS · 4× 2.5-inch bay expansion |
PCIe Gen5 Enterprise NVMe SSD
FLEX 9 / TITAN 9 · E3.S / E1.S / U.2 · NVMe 2.0 · up to 14.5 GB/s
FLEX 9 and TITAN 9 PCIe Gen5 x4 enterprise NVMe SSDs — E3.S J100E/J130E, E1.S J100S/J130S, U.2 flagships J960/J980, 30.72 TB J961/J981 and transparent-compression J960C. NVMe 2.0/OCP, FDP and P99.99/P99.999 QoS, up to 14.5 GB/s sequential read and 3.5M IOPS random read.
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| Model | Specification | Features | |
|---|---|---|---|
| J100E | 3D eTLC · E3.S · Gen5 x4 · 3.84–15.36TB | 1 DWPD · Read-Intensive |
 | J130E | 3D eTLC · E3.S · Gen5 x4 · 3.2–12.8TB | 3 DWPD · Mixed / Write-Intensive |
 | J100S | 3D eTLC · E1.S · Gen5 x4 · 3.84–7.68TB | 1 DWPD · Read-Intensive |
 | J130S | 3D eTLC · E1.S · Gen5 x4 · 3.2–6.4TB | 3 DWPD · Mixed / Write-Intensive |
 | J960 | 3D eTLC · U.2/U.3 · Gen5 x4 · 3.84–15.36TB | 1 DWPD · Read-Intensive |
 | J980 | 3D eTLC · U.2/U.3 · Gen5 x4 · 3.2–12.8TB | 3 DWPD · Mixed / Write-Intensive |
 | J961 | HD TLC · U.2/U.3 · Gen5 x4 · 1.92–30.72TB | 1 DWPD · Read-Intensive |
 | J981 | HD TLC · U.2/U.3 · Gen5 x4 · 1.6–25.6TB | 3 DWPD · Mixed / Write-Intensive |
 | J960C | 3D eTLC · U.2/U.3 · Gen5 x4 · 3.84–7.68TB | 1 DWPD · Transparent Compression |
PCIe Gen4 Enterprise NVMe SSD
CORE 7 / TITAN 7 · U.2/U.3 · AIC · single/dual-port · 1/3 DWPD
CORE 7 and TITAN 7 PCIe Gen4 x4 enterprise NVMe SSDs — from cost-optimized J750/J770 and flagship J760/J780 to 30.72 TB high-capacity J761/J781, dual-port HA J760D/J780D and AIC accelerators J200A/J230A. Two endurance lines (1 DWPD read-intensive and 3 DWPD mixed/write-intensive), up to 13.5 GB/s sequential read.
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| Model | Specification | Features | |
|---|---|---|---|
 | J750 | 3D eTLC · U.2/U.3 · Gen4 x4 · 1.92–15.36TB | 1 DWPD · Read-Intensive |
 | J770 | 3D eTLC · U.2/U.3 · Gen4 x4 · 1.6–12.8TB | 3 DWPD · Mixed / Write-Intensive |
| J760 | 3D eTLC · U.2/U.3 · Gen4 x4 · 1.92–15.36TB | 1 DWPD · Read-Intensive |
 | J780 | 3D eTLC · U.2/U.3 · Gen4 x4 · 1.6–12.8TB | 3 DWPD · Mixed / Write-Intensive |
 | J761 | HD TLC · U.2/U.3 · Gen4 x4 · 1.92–30.72TB | 1 DWPD · Read-Intensive |
 | J781 | HD TLC · U.2/U.3 · Gen4 x4 · 1.6–25.6TB | 3 DWPD · Mixed / Write-Intensive |
 | J760D | 3D eTLC · U.2/U.3 · Gen4 双端口 · 3.84–15.36TB | 1 DWPD · Read-Intensive |
 | J780D | 3D eTLC · U.2/U.3 · Gen4 双端口 · 3.2–12.8TB | 3 DWPD · Mixed / Write-Intensive |
 | J200A | 3D eTLC · AIC HHHL · Gen4 x8 · 1.92–7.68TB | 1 DWPD · Read-Intensive |
 | J230A | 3D eTLC · AIC HHHL · Gen4 x8 · 1.6–6.4TB | 3 DWPD · Mixed / Write-Intensive |
QLC High-Capacity Enterprise SSD
Q7 / Q9 · Gen4/Gen5 · 15.36–122.88 TB · object storage/archive
Q7 and Q9 3D enterprise QLC ultra-high-capacity SSDs, planned up to 122.88 TB per drive, spanning Gen4 single/dual-port J760Q/J760QD and Gen5 single/dual-port J960Q/J960QD — for object storage, backup, archive, AI checkpoints and warm data. Random write is quoted at 16KB/32KB and is not directly comparable to 4KB TLC KIOPS.
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| Model | Specification | Features | |
|---|---|---|---|
| J760Q | 3D QLC · U.2/U.3 · Gen4 x4 · 15.36–122.88TB | 0.4 DWPD · Read-Intensive / Capacity |
 | J760QD | 3D QLC · U.2/U.3 · Gen4 双端口 · 15.36–122.88TB | 0.4 DWPD · Read-Intensive / Capacity |
 | J960Q | 3D QLC · U.2/U.3 · Gen5 x4 · 15.36–122.88TB | 0.6 DWPD · Read-Intensive / Capacity |
 | J960QD | 3D QLC · U.2/U.3 · Gen5 双端口 · 15.36–122.88TB | 0.6 DWPD · Read-Intensive / Capacity |
Low-Latency High-Endurance Enterprise SSD
X3 / X7 / X9 · FAST NAND · 30–120 DWPD · KV cache/logs
X3/X7/X9 low-latency high-endurance enterprise SSDs on FAST NAND / XL-FLASH-class media — PCIe 3.0 compatibility J390X (30 DWPD), Gen4 J790X/J795X (60/100 DWPD) and Gen5 J990X/J995X (60/120 DWPD). Random-read latency down to the ~20 µs class, for metadata, logs, caching tiers and AI KV cache.
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| Model | Specification | Features | |
|---|---|---|---|
| J990X | FAST NAND · U.2/U.3 · Gen5 x4 · 1.6TB | 60 DWPD · Ultra-Low Latency |
 | J995X | FAST NAND · U.2/U.3 · Gen5 x4 · 0.8TB | 120 DWPD · Ultra-Low Latency |
 | J790X | FAST NAND · U.2/U.3 · Gen4 x4 · 0.8–1.6TB | 60 DWPD · Ultra-Low Latency |
 | J795X | FAST NAND · U.2/U.3 · Gen4 x4 · 0.4–0.8TB | 100 DWPD · Ultra-Low Latency |
 | J390X | XL-FLASH · U.2/U.3 · Gen3 x4 · 0.75–1.6TB | 30 DWPD · Ultra-Low Latency |
PCIe Gen3 Long-Supply Enterprise SSD
LEGACY 3 · U.2/U.3 · legacy compatibility · long-term supply
LEGACY 3 PCIe 3.0 x4 enterprise NVMe SSDs on a mature Gen3 enterprise JDM platform — J360 (1 DWPD read-intensive) and J380 (3 DWPD mixed/write-intensive), for long-term supply into legacy servers, industry appliances and compatible replacement, with device EOL and customer compatibility verified.
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DDR5 Server Memory
JH-R5 / R5X / E5 / V5 / H5 · RDIMM / UDIMM / VLP / 3DS · 4800–6400 MT/s
JH Semiconductor DDR5 server memory — ServerCore RDIMM (JH-R5, 4800/5600), ServerX high-bandwidth RDIMM (JH-R5X, 6400), EntryECC UDIMM (JH-E5), ServerEdge VLP RDIMM (JH-V5) and ServerDensity 3DS RDIMM (JH-H5, 256 GB), 16 GB–256 GB with on-die ECC + RCD, for general/AI servers, databases, virtualization and edge nodes; next-gen MRDIMM (JH-MR5) is reserved and released as platforms freeze. 5-year warranty.
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| Model | Specification | Features | |
|---|---|---|---|
| DDR5 ECC RDIMM | DDR5 · ECC RDIMM · 16 – 128GB | 4800 / 5600 MT/s |
 | DDR5 ECC RDIMM-6400 (ServerX) | DDR5 · ECC RDIMM (ServerX) · 32 – 128GB | 6400 MT/s |
 | DDR5 ECC UDIMM | DDR5 · ECC UDIMM · 16 / 32 / 48GB | 5600 MT/s |
 | DDR5 VLP ECC RDIMM | DDR5 · VLP ECC RDIMM (very-low-profile) · 16 – 64GB | 5600 MT/s |
 | DDR5 3DS ECC RDIMM | DDR5 · 3DS ECC RDIMM · 256GB | 5600 / 6400 MT/s |
DDR4 Server Memory
JH-E4 / R4 / L4 · ECC UDIMM / RDIMM / LRDIMM · 3200 MT/s
JH Semiconductor DDR4 server memory — ServerCore RDIMM (JH-R4), EntryECC UDIMM (JH-E4) and ServerDensity LRDIMM (JH-L4), 3200 MT/s, 16 GB–128 GB, with fixed BOM and 100% burn-in, for legacy servers, domestic-CPU replacement, databases and high-capacity virtualization. 5-year warranty.
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| Model | Specification | Features | |
|---|---|---|---|
| DDR4 ECC RDIMM | DDR4 · ECC RDIMM · 16 / 32 / 64GB | 3200 MT/s |
 | DDR4 ECC UDIMM | DDR4 · ECC UDIMM · 16 / 32GB | 3200 MT/s |
 | DDR4 (3DS) LRDIMM | DDR4 · ECC LRDIMM (incl. 3DS) · 64 / 128GB | 3200 MT/s |
CXL Memory Expansion
JH-CX5 · CXL 2.0 Type-3 · E3.S · 64–256 GB
JH Semiconductor MemoryLink CXL memory-expansion modules (JH-CX5) in CXL 2.0 Type-3, E3.S EDSFF form factor, 64/128/192/256 GB, targeting 32 GB/s — for memory expansion, pooling, and AI/cloud infrastructure. Currently a partner-controller + fixed-DRAM-BOM co-research stage.
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| Model | Specification | Features | |
|---|---|---|---|
| CXL 2.0 内存扩展模组 | CXL 2.0 · CXL 2.0 Type-3 (E3.S) · 64 / 128 / 192 / 256GB | CXL 2.0 · 目标 32 GB/s |
2.5" SATA Enterprise SSD
SATA III 6Gb/s, full SLC-to-TLC NAND coverage
Full SLC-to-TLC 2.5-inch SATA enterprise SSDs for industrial control, rail transit, surveillance, IoT, retail, and self-service terminals — with static/dynamic wear leveling, S.M.A.R.T., TRIM, and garbage collection, rated at 2 million hours MTBF.
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| Model | Specification | Features | |
|---|---|---|---|
| JH25S2XS | SLC · SATA III (6Gb/s) · 8GB~32GB | Read Up to 530MB/s / Write Up to 370MB/s |
 | JH25S2XM | MLC · SATA III (6Gb/s) · 32GB~256GB | Read Up to 530MB/s / Write Up to 380MB/s |
 | JH25M5XT | TLC · SATA III (6Gb/s) · 128GB~2TB | Read Up to 560MB/s / Write Up to 520MB/s |
 | JH25P2XT | TLC · SATA III (6Gb/s) · 256GB~4TB | Read Up to 560MB/s / Write Up to 530MB/s |
 | JH25P1XT | TLC · SATA III (6Gb/s) · 128GB~1TB | Read Up to 560MB/s / Write Up to 510MB/s |
 | JH25G1XD | TLC · SATA III (6Gb/s) · 960GB~7.68TB | Read Up to 560MB/s / Write Up to 540MB/s |
M.2 NVMe SSD Full Lineup
PCIe 4.0/5.0, full 2242/2280/22110 size coverage
Spanning 2242, 2280, and 22110 M.2 lengths with both PCIe 4.0 and 5.0 interfaces, reaching up to 12,000MB/s reads, with efficient thermal design and sensors for data centers, AI computing, industrial control, and robotics.
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| Model | Specification | Features | |
|---|---|---|---|
| JHNN5G9XT | eTLC · M.2 2280 PCIe Gen5 x4 · 512GB~4TB | Read Up to 12000MB/s / Write Up to 10000MB/s |
 | JHNN5M7XT | TLC · M.2 2280 PCIe Gen4 x4 · 256GB~4TB | Read Up to 7400MB/s / Write Up to 6500MB/s |
 | JHNN5T1KE | eTLC · M.2 2280 PCIe Gen4 x4 · 400GB~3.84TB | Read Up to 7000MB/s / Write Up to 2400MB/s |
 | JHNN2M7XT | TLC · M.2 2242 PCIe Gen4 x4 · 256GB~1TB | Read Up to 5100MB/s / Write Up to 4500MB/s |
 | JHNN6T1KE | eTLC · M.2 22110 PCIe Gen4 x4 · 800GB~7.68TB | Read Up to 7100MB/s / Write Up to 2500MB/s |
SATA DOM Industrial Storage
SATA III 6Gb/s, ultra-compact industrial module
Ultra-compact SATA DOM industrial storage modules for industrial control, rail transit, and network equipment, with hot-swap support and stable operation across the full temperature range, rated at 2 million hours MTBF.
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Manufacturing & Technology
Intelligent Testing · Advanced Technology · Data Security
Our proprietary JH-ZS101 intelligent test system integrates five SSD test processes — from initialization to burn-in — on one platform; combined with power-loss protection, 3D NAND, wide-temperature technology, AES-256 hardware encryption, write protection, and secure destruction for comprehensive reliability and data security.
JH-ZS101 Intelligent Test System
Tests up to 600 SATA or 480 NVMe SSDs per batch, integrating five test processes with zone temperature control and remote power management.
Power Loss Protection
Onboard capacitors ensure cached data is fully flushed to NAND during unexpected power loss, preventing corruption.
3D NAND Flash Technology
Vertically stacked storage cells balance capacity, performance, and endurance for data-intensive industrial applications.
Wide Temperature Technology
Supports -40°C to 85°C operation with advanced thermal management for stable performance in extreme environments.
AES-256 Hardware Encryption
256-bit hardware encryption in real time, guarding against unauthorized access for defense, finance, and other high-security use cases.
Write Protection / Secure Destruction
Read-only mode activated via physical switch or secure command; secure destruction instantly and physically destroys chip circuitry to erase data.
Product Specification Comparison
Select a product category to quickly compare core specifications and features across models
| Product Model | Specifications | Key Features |
|---|---|---|
| J100E | 3D eTLC · E3.S · Gen5 x4 · 3.84–15.36TB | 1 DWPD · Read-Intensive |
| J130E | 3D eTLC · E3.S · Gen5 x4 · 3.2–12.8TB | 3 DWPD · Mixed / Write-Intensive |
| J100S | 3D eTLC · E1.S · Gen5 x4 · 3.84–7.68TB | 1 DWPD · Read-Intensive |
| J130S | 3D eTLC · E1.S · Gen5 x4 · 3.2–6.4TB | 3 DWPD · Mixed / Write-Intensive |
| J960 | 3D eTLC · U.2/U.3 · Gen5 x4 · 3.84–15.36TB | 1 DWPD · Read-Intensive |
| J980 | 3D eTLC · U.2/U.3 · Gen5 x4 · 3.2–12.8TB | 3 DWPD · Mixed / Write-Intensive |
| J961 | HD TLC · U.2/U.3 · Gen5 x4 · 1.92–30.72TB | 1 DWPD · Read-Intensive |
| J981 | HD TLC · U.2/U.3 · Gen5 x4 · 1.6–25.6TB | 3 DWPD · Mixed / Write-Intensive |
| J960C | 3D eTLC · U.2/U.3 · Gen5 x4 · 3.84–7.68TB | 1 DWPD · Transparent Compression |
Parameters shown are typical values; actual performance may vary by application. Contact us for detailed specifications.
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