DDR5 Server Memory
DDR5 3DS ECC RDIMM
JH ServerDensity DDR5 3DS ECC RDIMM (JH-H5), 5600/6400 MT/s, 256 GB, first-party 3DS dies with fixed BOM, for in-memory databases, large-scale virtualization and high-density AI nodes.
DDR5256GB3DS ECC RDIMM5600 / 6400 MT/s
Applications:Database / OLTPAI ServersVirtualization
Specifications
| Memory Technology | DDR5 |
|---|---|
| Module Type | 3DS ECC RDIMM |
| Data Rate | 5600 / 6400 MT/s |
| PC Rating | PC5-44800R / PC5-51200R |
| Capacity | 256GB |
| Rank / Organization | 4R×4 / 3DS |
| DRAM Die Density | 32 Gb (3DS) |
| Data Bus Width | 80-bit (2×40-bit sub-channels) |
| ECC | On-die ECC + Register (RCD) |
| Key Components | 3DS DRAM · RCD · PMIC · SPD Hub · temp sensor |
| Peak Bandwidth | 44.8 / 51.2 GB/s |
| CAS Latency / Timing | CL46 / CL52 |
| Voltage | VDD / VDDQ 1.1V · VPP 1.8V |
| Dimensions | 133.35 × 31.25 mm |
| Pin Count | 288-Pin |
| Operating Temperature | 0 ~ 85°C (C-grade) |
| Storage Temperature | -55 ~ 100°C (per device rating) |
| Warranty | 3-year limited warranty |
| Platform Support | Intel Xeon / AMD EPYC / domestic platforms (per QVL) |
| Target Market | In-memory databases, large-scale virtualization, high-density AI nodes |
| Product Phase | P2 — Project-based / validation |
*1 Read/write values may vary slightly by capacity and test platform. *2 Customization available for specific applications.
Product Features
Fixed base model: model numbers do not change with DRAM/RCD/PMIC vendors; supply variants use only G/D and hardware-revision suffixes
Fixed BOM: no mixing of dies, RCD, PMIC or PCB within one order/batch; any change goes through PCN
G-then-D: international-vendor BOM closes compatibility and delivery first; localized BOM is qualified in parallel and released as the D version
Platform QVL: every "Intel/AMD/domestic-CPU compatible" claim maps to a specific server/board model and test record
100% inspection, per-module burn-in and batch traceability, 5-year limited warranty
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