PCIe Gen4 Enterprise NVMe SSD

CORE 7 / TITAN 7 · U.2/U.3 · AIC · single/dual-port · 1/3 DWPD

CORE 7 and TITAN 7 PCIe Gen4 x4 enterprise NVMe SSDs — from cost-optimized J750/J770 and flagship J760/J780 to 30.72 TB high-capacity J761/J781, dual-port HA J760D/J780D and AIC accelerators J200A/J230A. Two endurance lines (1 DWPD read-intensive and 3 DWPD mixed/write-intensive), up to 13.5 GB/s sequential read.

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Product Models

Specification Comparison

J750
NAND: 3D eTLC
Interface: U.2/U.3 · Gen4 x4
Capacity: 1.92–15.36TB
1 DWPD · Read-Intensive
J770
NAND: 3D eTLC
Interface: U.2/U.3 · Gen4 x4
Capacity: 1.6–12.8TB
3 DWPD · Mixed / Write-Intensive
J760
NAND: 3D eTLC
Interface: U.2/U.3 · Gen4 x4
Capacity: 1.92–15.36TB
1 DWPD · Read-Intensive
J780
NAND: 3D eTLC
Interface: U.2/U.3 · Gen4 x4
Capacity: 1.6–12.8TB
3 DWPD · Mixed / Write-Intensive
J761
NAND: HD TLC
Interface: U.2/U.3 · Gen4 x4
Capacity: 1.92–30.72TB
1 DWPD · Read-Intensive
J781
NAND: HD TLC
Interface: U.2/U.3 · Gen4 x4
Capacity: 1.6–25.6TB
3 DWPD · Mixed / Write-Intensive
J760D
NAND: 3D eTLC
Interface: U.2/U.3 · Gen4 双端口
Capacity: 3.84–15.36TB
1 DWPD · Read-Intensive
J780D
NAND: 3D eTLC
Interface: U.2/U.3 · Gen4 双端口
Capacity: 3.2–12.8TB
3 DWPD · Mixed / Write-Intensive
J200A
NAND: 3D eTLC
Interface: AIC HHHL · Gen4 x8
Capacity: 1.92–7.68TB
1 DWPD · Read-Intensive
J230A
NAND: 3D eTLC
Interface: AIC HHHL · Gen4 x8
Capacity: 1.6–6.4TB
3 DWPD · Mixed / Write-Intensive
Power-loss protection (PLP) · end-to-end data protection · T10 DIF/DIX integrity
TCG Opal encryption · Secure Boot · Sanitize secure erase · namespace management
SMART / telemetry · online firmware update & rollback · hot-swap
Frozen model names; capacity/NAND/controller/firmware changes managed via SKU, PN, revision and ECN
5-year limited warranty; production units released after EVT/DVT/PVT with locked PN/BOM/FW

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