DDR4 Server Memory
DDR4 (3DS) LRDIMM
JH ServerDensity DDR4 LRDIMM (JH-L4), 3200 MT/s, 64/128 GB (incl. 3DS), for high-capacity DDR4 platforms, in-memory databases and virtualization; only for LRDIMM-capable platforms, qualified per server model.
DDR464 / 128GBECC LRDIMM (incl. 3DS)3200 MT/s
Applications:Database / OLTPVirtualizationEnterprise Servers
Specifications
| Memory Technology | DDR4 |
|---|---|
| Module Type | ECC LRDIMM (incl. 3DS) |
| Data Rate | 3200 MT/s |
| PC Rating | PC4-25600L |
| Capacity | 64 / 128GB |
| Rank / Organization | 4R×4 / 3DS |
| DRAM Die Density | 8 / 16 Gb (3DS) |
| Data Bus Width | 72-bit (64 data + 8 ECC) |
| ECC | Register + ECC (LRDIMM buffered) |
| Key Components | DRAM · RCD · Data Buffer · SPD · temp sensor |
| Peak Bandwidth | 25.6 GB/s |
| CAS Latency / Timing | CL22 (22-22-22) |
| Voltage | 1.2V |
| Dimensions | 133.35 × 31.25 mm |
| Pin Count | 288-Pin |
| Operating Temperature | 0 ~ 85°C (C-grade) |
| Storage Temperature | -55 ~ 100°C (per device rating) |
| Warranty | 3-year limited warranty |
| Platform Support | Platforms that explicitly support LRDIMM (per-model qualification) |
| Target Market | High-capacity DDR4 platforms, databases, virtualization |
| Product Phase | P2 — Project-based / validation |
*1 Read/write values may vary slightly by capacity and test platform. *2 Customization available for specific applications.
Product Features
Fixed base model: model numbers do not change with DRAM/RCD/PMIC vendors; supply variants use only G/D and hardware-revision suffixes
Fixed BOM: no mixing of dies, RCD, PMIC or PCB within one order/batch; any change goes through PCN
G-then-D: international-vendor BOM closes compatibility and delivery first; localized BOM is qualified in parallel and released as the D version
Platform QVL: every "Intel/AMD/domestic-CPU compatible" claim maps to a specific server/board model and test record
100% inspection, per-module burn-in and batch traceability, 5-year limited warranty
Interested in DDR4 (3DS) LRDIMM?
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