R&D Center
Building product R&D and engineering validation capabilities for high-reliability electronic scenarios, focusing on enterprise SSD, AI server storage, SSD controllers & firmware, and semiconductor device engineering.
R&D Focus Areas
Building four core R&D directions around existing customers and future product roadmap
Enterprise SSD Productization
Focusing on PCIe 4.0/5.0 U.2, E3.S form factors, developing products around performance, reliability, power efficiency, and firmware management
Controller IC & Firmware
FTL mapping, LDPC ECC, power-loss protection, wear leveling, garbage collection, data placement strategies and AI inference storage acceleration
AI Server Storage Modules
High-bandwidth, low-latency storage solutions for AI training, inference, KV Cache, and data preprocessing, including HBM heterogeneous integration packaging and microchannel thermal management
Data Platform & Intelligent Analysis
Self-developed software platforms for electronic component management, chip data analysis, big data stream computing, quality governance, and AI chip optimization design, forming a complete engineering support system
R&D Capability Map
Six core capabilities supporting the full product R&D lifecycle
Product Definition
Defining SSD, memory, and semiconductor device specifications based on customer scenarios
Hardware Design
PCB, interface, power, signal integrity, and thermal design
Firmware & Algorithms
FTL, GC, wear leveling, LDPC, SMART, Telemetry development
Testing & Validation
Performance, reliability, compatibility, power, thermal, and PLP testing
Supply Chain Engineering
Converting R&D specs into procurable, producible, deliverable BOM systems
Customer Scenario Adaptation
Application adaptation for AI servers, data centers, industrial control, and new energy
Technology Roadmap
A clear path from supply chain services to proprietary product development
Phase 1
2025
PCIe 5.0 NVMe 2.0 SSD mass production, M.2/U.2/E3.S full form factor, AI storage modules
Phase 2
2025–2026
PCIe 5.0 U.2/E3.S enterprise SSD full lineup, proprietary controller firmware, CXL storage expansion
Phase 3
2026–2027
PCIe 6.0 R&D, proprietary controller tape-out, CXL 3.0 memory-semantic storage, HBM4 integration
Phase 4
2027+
Next-gen storage platform, PCIe 6.0 mass production, compute-in-memory architecture, full-stack self-controllable
Note: All items are labeled with their actual R&D status. No false claims.
Testing & Validation System
Comprehensive validation covering performance, reliability, compatibility, thermal, power, and data integrity
Performance Testing
Sequential R/W, Random R/W, Mixed workload, Queue depth, Latency
Reliability Testing
Stress testing, Aging test, Bad block monitoring, Lifespan evaluation
Power-Loss Protection
Abnormal power-off, Data consistency, Cache flush mechanism
Thermal Testing
High/low temperature, Full-load thermal rise, Heat dissipation path
Power Testing
Idle, R/W, Mixed workload, Peak power consumption
Compatibility Testing
Motherboard, Server, OS, RAID card, BIOS
Data Integrity
CRC, ECC, End-to-end protection, BER monitoring
Customer Scenario Validation
Database, AI training, File system, Logging, Virtualization
Looking for R&D Collaboration?
JH Semiconductor is open to joint R&D collaboration with universities, research institutes, and industry experts to advance enterprise storage and semiconductor technology commercialization.