CXL Memory Expansion

CXL 2.0 内存扩展模组

JH MemoryLink CXL 2.0 Type-3 memory-expansion module (JH-CX5), E3.S form factor, 64–256 GB, targeting 32 GB/s — for memory expansion, pooling and AI/cloud infrastructure; partner-controller + fixed-DRAM-BOM co-research.

CXL 2.064 / 128 / 192 / 256GBCXL 2.0 Type-3 (E3.S)CXL 2.0 · 目标 32 GB/s
CXL 2.0 内存扩展模组 — CXL Memory Expansion
Applications:Memory Expansion / PoolingAI ServersCloud & VirtualizationData Center

Specifications

Memory TechnologyCXL 2.0
Module TypeCXL 2.0 Type-3 (E3.S)
Data RateCXL 2.0 · 目标 32 GB/s
PC Rating
Capacity64 / 128 / 192 / 256GB
Rank / Organization
DRAM Die DensityDDR5 16 / 24 / 32 Gb
Data Bus WidthCXL.mem (DDR5 media base)
ECCEnd-to-end ECC + CXL link CRC
Key ComponentsCXL controller · DDR5 DRAM · PMIC · SPD
Peak Bandwidth32 GB/s(目标 / target)
CAS Latency / TimingDDR5 侧 46-45-45
Voltage
CXL LinkPCIe 5.0 ×8
Access Latency (target)250 – 300 ns
DimensionsEDSFF E3.S
Pin CountE3.S (EDSFF)
Operating Temperature0 ~ 85°C (C-grade)
Storage Temperature-55 ~ 100°C (per device rating)
Warranty3-year limited warranty
Platform SupportServer platforms supporting CXL 2.0 (joint validation)
Target MarketMemory expansion, pooling, AI and cloud infrastructure
Product PhaseP2 — Project-based / validation

*1 Read/write values may vary slightly by capacity and test platform. *2 Customization available for specific applications.

Product Features

Fixed base model: model numbers do not change with DRAM/RCD/PMIC vendors; supply variants use only G/D and hardware-revision suffixes
Fixed BOM: no mixing of dies, RCD, PMIC or PCB within one order/batch; any change goes through PCN
G-then-D: international-vendor BOM closes compatibility and delivery first; localized BOM is qualified in parallel and released as the D version
Platform QVL: every "Intel/AMD/domestic-CPU compatible" claim maps to a specific server/board model and test record
100% inspection, per-module burn-in and batch traceability, 5-year limited warranty

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