Visit Overview
In late April 2026, JH Semiconductor's team traveled to Beijing to attend IC China 2026, the China International Integrated Circuit Industry Expo. This edition covered more than 50,000 square meters of exhibition space and gathered over 800 companies from around the world, spanning the full industry chain of IC design, manufacturing, packaging and test, and equipment and materials.
Two Main Threads: Memory and AI Chips
The team concentrated on the memory chip and AI chip zones. On the memory side, it followed the latest mass-production progress of domestic NAND Flash and DRAM. NAND is the principal bill-of-materials component of an enterprise SSD, and its supply landscape and generational evolution directly shape SSD cost and capacity roadmaps — an upstream variable that JH Semiconductor, which is developing its own enterprise SSDs, needs to track over the long term. On the AI chip side, the team looked into the ecosystem development of domestic AI inference chips, including the completeness of software stacks and the maturity of whole-system enablement.
Observations on Advanced Packaging
The team also followed the application of advanced packaging in the HBM and chiplet domains. Stacked HBM packaging governs the memory supply available to AI accelerator cards, while chiplets ease the cost pressure of advanced process nodes through multi-die integration; together they are reshaping the division of labor in the high-performance chip supply chain. The observations from this visit will serve as market reference for the company's product planning.