Visit Overview
From March 25 to 27, 2026, JH Semiconductor's technical team visited SEMICON China 2026 at the Shanghai New International Expo Centre. The exhibition gathered more than 1,000 semiconductor equipment and materials companies from around the world. Following its planned itinerary, the team toured three zones — advanced packaging, semiconductor materials and test equipment — and held on-site exchanges with a number of equipment vendors.
Why Advanced Packaging and HBM Matter
HBM (High Bandwidth Memory) relies on through-silicon vias and stacked packaging to integrate multiple DRAM dies vertically next to the processor, and has become the mainstream memory form for AI accelerator cards. The pace at which packaging equipment and capacity evolve feeds directly into the supply and lead times of GPUs and high-end memory. For JH Semiconductor, which operates server, GPU and memory supply-chain businesses in parallel, tracking the technology roadmap and domestic-substitution progress of the packaging segment helps in assessing shifts in the upstream supply landscape. The team also followed the iteration of wafer-level test equipment — the company itself operates the JH-ZS101 SSD test equipment business and maintains a long-term interest in how test methods and production-line organization evolve.
Next Steps
The technical materials collected from equipment vendors during the visit will be organized and archived for reference in subsequent supply-chain planning and product-line evaluation. Expo visits of this kind are part of the company's routine industry-intelligence work.