Company News

JH Semiconductor Visits SEMICON China 2025, Tracking Advanced Packaging and Memory Manufacturing

2025-06-27SEMICON China / semiconductor exhibition / Shanghai

From June 25 to 27, 2025, the JH Semiconductor team visited SEMICON China 2025 in Shanghai, focusing on the latest developments in advanced packaging, memory chip manufacturing and power semiconductor processes.

The Visit

From June 25 to 27, 2025, the JH Semiconductor team visited SEMICON China 2025 at the Shanghai New International Expo Centre. As one of the world's largest semiconductor exhibitions, the show gathered semiconductor equipment, materials and service companies from around the globe, presenting a fairly complete picture of the technology landscape in the upstream stages of semiconductor manufacturing.

Industry Observations

During the show, the team attended several technical forums, focusing on the latest developments in advanced packaging, memory chip manufacturing and power semiconductor processes. Advanced packaging is becoming a key path to higher chip performance, and its progress directly shapes how high-performance computing and storage products evolve. Meanwhile, process and capacity changes on the memory manufacturing side propagate down the value chain, influencing the supply rhythm and price trajectory of memory devices.

Value for Business Judgment

JH Semiconductor's business spans both in-house enterprise storage product development and server, GPU and memory supply-chain services, and upstream manufacturing trends matter to both lines. Information from the manufacturing side helps the company assess memory-device supply conditions and time its stocking decisions, while process trends provide background for media and form-factor choices in its enterprise SSD product planning.

Keywords
SEMICON Chinasemiconductor exhibitionShanghaiadvanced packagingmemory chip manufacturingJH Semiconductor