The Visit
From April 23 to 25, 2025, the JH Semiconductor team visited NEPCON China 2025, the Asian electronics production equipment and microelectronics industry exhibition, at the Shanghai World Expo Exhibition Hall. The show focuses on electronics manufacturing equipment, SMT surface-mount technology and semiconductor packaging and test, making it an important window on equipment and process trends in electronics manufacturing.
Areas of Focus
The team concentrated on the latest advances in semiconductor packaging and test equipment and SMT placement technology. Packaging plays an increasingly prominent role in improving chip performance, and advanced packaging has become a key path for sustaining compute growth; its process evolution directly shapes the product forms and supply structure of memory and logic chips. Meanwhile, the precision and automation level of SMT bears directly on yield and efficiency in downstream system manufacturing.
Supply-Chain Observations
Conversations with manufacturers revealed that many are looking for stable suppliers of domestic-substitute components, hoping to add local supply options without compromising quality or delivery. As a company focused on component and server supply-chain services, JH Semiconductor will treat these shifts in demand as a reference for its business development direction.